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AMAT 0040-33590
Product Name: 200mm Cathode Base Cooling Assembly
Product Description: A high-performance cooling base assembly that provides active thermal management for 200mm RF cathodes in PECVD chambers, maintaining stable process temperatures during high-power deposition.
Technical Specifications:
- Material: 6061-T6 aluminum (hard-anodized)
Detailed content
- Cooling Circuit: Helical internal water channel
- Flow Rate: 4 L/min (deionized water)
- Pressure Drop: <0.5 bar at 4 L/min
- Temperature Control Range: 20°C to 120°C
- Flatness: ≤0.03 mm across cathode interface
- Mounting: 8-point bolted flange (M6 screws)
- Dielectric Strength: >5 kV DC
Functional Features:
- Uniform thermal distribution across cathode surface
- High thermal conductivity for rapid heat dissipation
- Electrically isolating anodized coating to prevent RF leakage
- Corrosion resistance to process byproducts and cleaning agents
- Precision-machined for optimal thermal contact with cathode
Application Scenarios: Cooling for 200mm RF cathodes in AMAT P5000 and Centura PECVD systems (TEOS, SiNx, SiO₂ deposition).
