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AMAT 0040-32530
Product Name: Cold Plate / Liquid Cooling Assembly
Product Description: A high-performance liquid-cooled heat exchanger designed for efficient thermal management of high-power components, electrostatic chucks (ESC), and process modules. Provides precise, closed-loop temperature control.
Technical Specifications:
- Material: Oxygen-free copper (OFC) or aluminum alloy
Detailed content
- Cooling Circuit: Dual-zone helical channels for uniform heat extraction
- Coolant: Deionized (DI) water or fluorinated fluid
- Flow Rate: Up to 4 L/min per zone
- Temperature Range: -20°C to +150°C
- Pressure Rating: 10 bar (150 psig)
- Flatness: < 5μm across mounting surface
- Leak Rate: < 1 x 10⁻⁹ mbar·l/s
Key Features:
- Ultra-high thermal conductivity for rapid heat removal
- Dual-zone design enables independent temperature profiling
- Low thermal resistance ensures efficient cooling
- Corrosion-resistant wetted parts for long service life
- Sealed, vacuum-compatible construction
Application Scenarios:
Integrated into AMAT Centura IPS (Impurity Process Solution), Etch, and high-power PVD chambers. Cools ESC pedestals, RF generators, and high-power process components.
