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AMAT 0040-20332

  • Product Name: AMAT 0040 – 20332 Chemical Delivery Pump for Semiconductor Processes
  • Product Introduction: The AMAT 0040 – 20332 is a high – precision chemical delivery pump used in semiconductor manufacturing processes. It is responsible for accurately and reliably delivering various chemicals, such as photoresists, developers, etchants, and cleaning agents, to different process stations in a semiconductor fab. The precise control of chemical delivery is crucial for ensuring consistent process results and high – quality semiconductor devices.
  • Technical Specifications:
    • Pump Type: It is a diaphragm – type pump, which provides excellent chemical compatibility and can handle a wide range of corrosive and abrasive chemicals.

Detailed content

    • Flow Rate Accuracy: Can achieve a flow rate accuracy of ±0.5% over a wide flow rate range from 0.1 ml/min to 1000 ml/min. This high level of accuracy is essential for processes that require precise chemical dosing.
    • Pressure Range: Operates within a pressure range of 0 – 10 bar, allowing it to deliver chemicals to different process chambers with varying pressure requirements.
  • Functional Features:
    • Leak – Free Operation: The diaphragm design and high – quality seals ensure leak – free operation, preventing the release of hazardous chemicals into the environment and protecting the surrounding equipment from contamination.
    • Self – Priming Capability: The pump has self – priming capability, which means it can start pumping chemicals even when the suction line is initially empty. This simplifies the pump startup process and reduces the risk of air entrainment in the chemical delivery system.
    • Easy Maintenance: It is designed for easy disassembly and cleaning, allowing for quick maintenance and reducing downtime in the semiconductor production line.
  • Application Scenarios:
    • Photolithography Process: Delivers photoresists and developers to the photolithography equipment, ensuring precise application of these chemicals on the wafer surface for accurate pattern transfer.
    • Etching Process: Supplies etchants to the etching chambers, controlling the etch rate and uniformity by accurately delivering the required amount of chemical.

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