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AMAT 0040-10122
- Product Name: AMAT 0040 – 10122 Semiconductor Wafer Cleaning Nozzle
- Product Introduction: The AMAT 0040 – 10122 is a specialized nozzle designed for semiconductor wafer cleaning processes. In semiconductor manufacturing, wafer cleaning is a crucial step to remove contaminants such as particles, organic residues, and metal ions from the wafer surface before and after various processing steps. This nozzle plays a vital role in delivering cleaning fluids effectively and uniformly to ensure high – quality cleaning results.
- Technical Specifications:
- Material: Constructed from high – purity polyether ether ketone (PEEK) and stainless steel. PEEK offers excellent chemical resistance to a wide range of cleaning chemicals, while stainless steel provides structural strength and durability.
Detailed content
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- Nozzle Geometry: It has a precisely engineered conical – shaped nozzle tip with a small orifice diameter of 0.5 mm. This design allows for the generation of a high – velocity, focused jet of cleaning fluid.
- Flow Rate Range: Can handle a flow rate of cleaning fluid in the range of 10 – 100 ml/min, which can be adjusted according to the specific cleaning requirements and wafer size.
- Functional Features:
- Uniform Fluid Distribution: The nozzle’s design ensures that the cleaning fluid is distributed uniformly across the wafer surface, even at high rotation speeds of the wafer during cleaning. This helps in removing contaminants from all areas of the wafer effectively.
- Minimized Splashing: The focused jet of fluid reduces splashing, preventing the re – deposition of contaminants on the wafer or nearby equipment. This is essential for maintaining a clean environment in the semiconductor fab.
- Long Service Life: The high – quality materials used in its construction make it resistant to wear and corrosion, resulting in a long service life. This reduces the frequency of nozzle replacement, lowering production costs.
- Application Scenarios:
- Pre – Process Wafer Cleaning: Used before deposition, etching, and lithography processes to remove native oxides, particles, and other contaminants from the wafer surface, ensuring good adhesion and process quality.
- Post – Process Wafer Cleaning: After processes such as chemical mechanical polishing (CMP) and plasma etching, it helps in removing residual slurry, etch by – products, and other impurities, preparing the wafer for subsequent processing steps.
