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AMAT 0040-06315
Product Description: A precision-machined, leak-tight gas manifold block engineered for centralized routing and distribution of ultra-high-purity process gases in semiconductor manufacturing equipment. It serves as a critical connection hub for multiple gas lines, ensuring contamination-free, consistent gas delivery to process chambers while optimizing space in gas panels and sub-fab installations. The manifold is designed to eliminate dead legs and minimize particle generation, meeting the strict purity requirements of advanced semiconductor processes.
Technical Specifications:
– Material: 316L electropolished stainless steel (EP finish)
– Surface Finish: Ra < 0.4 μm (internal and external) for UHP compatibility
Detailed content
Port Configuration: 12 ports (1/4-inch VCR face-seal fittings, male/female configurable)
– Design Pressure: 250 PSIG (17.2 bar)
– Operating Temperature: -40°C to +120°C
– Leak Rate: < 1×10⁻⁹ atm·cc/s He (helium leak-tested)
– Internal Geometry: Zero dead-leg design to prevent gas trapping and cross-contamination
– Dimensions: 200mm × 150mm × 60mm
– Weight: 3.8 kg
– Compliance: SEMI C12, RoHS, CE, and ISO 14644-1 (Class 1 cleanroom compatible)
Functional Features:
– Zero dead-leg structure eliminates gas retention, reducing cross-contamination between process gases
– Electropolished surfaces minimize particle generation and outgassing, ensuring UHP gas purity
– Precision-drilled flow channels provide uniform gas distribution across all ports
– Compact design optimizes space utilization in high-density gas panels and sub-fab environments
– Compatible with all common semiconductor process gases (Ar, N₂, O₂, SiH₄, NH₃, CF₄, etc.)
– Pre-passivated and vacuum-packaged for immediate installation and UHP service
– Easy mounting via panel or bracket, with pre-drilled holes for quick integration
Application Scenarios:
– UHP gas distribution in CVD (Chemical Vapor Deposition) and ALD (Atomic Layer Deposition) chambers
– Multi-gas routing in etch process tools (RIE, ICP etch)
– Gas panel manifold assemblies for 200mm and 300mm wafer fabrication lines
– Purge gas distribution in load locks and transfer chambers
– Sub-fab gas distribution networks for semiconductor fabs
