Digital guide
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Detailed content
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- Hole Pattern: 1,200 precisely drilled holes of 0.5mm diameter
- Surface Treatment: Hard anodized with PTFE impregnation
- Flatness: ±0.02mm across entire surface
- Diameter: 300mm for 300mm wafer processing
- Functional Features:
- Ensures exceptional gas distribution uniformity (±1% across wafer)
- Minimizes process variation and improves wafer-to-wafer repeatability
- Excellent chemical resistance to precursor gases
- Low particle generation design
- Easy to clean and maintain
- Application Scenarios:
- Used in AMAT Ultima X and Producer SE CVD chambers
- Applied in TEOS and high-density plasma deposition processes
- Deployed in thin film dielectric layer formation
- Utilized in advanced semiconductor manufacturing for 300mm wafers
- Suitable for processes requiring ultra-uniform film deposition
