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AMAT 0040-00290 Precision O-Ring Seal
Product Overview: The AMAT 0040-00290 is a precision O-ring seal designed exclusively for Applied Materials semiconductor equipment. It serves as a critical sealing component in vacuum systems, gas delivery lines, and process chambers, creating a leak-tight barrier to prevent air leakage, gas contamination, and pressure loss. This O-ring is manufactured from high-performance elastomers engineered to withstand the harsh conditions of semiconductor fabs, including high temperatures, vacuum environments, and exposure to reactive process gases. It is a key component for maintaining the integrity of the process environment, ensuring consistent performance and reducing equipment downtime.
Technical Specifications: – Material Composition: Fluorocarbon (FPM/Viton) elastomer with a shore hardness of 75 durometer (A), offering excellent chemical resistance and thermal stability.
Detailed content
– Dimensions: Inner diameter (ID) of 2.90mm, cross-sectional width (W) of 1.20mm, ensuring precise fit with AMAT’s standard sealing grooves. – Temperature Range: -20°C to 200°C, compatible with the temperature fluctuations encountered in semiconductor processing. – Vacuum Rating: Ultra-high vacuum (UHV) compatible, with a leak rate ≤ 1×10⁻¹² Pa·m³/s (He) when properly installed. – Chemical Compatibility: Resistant to reactive gases (SiH₄, NH₃, H₂), corrosive gases (CF₄, Cl₂, HF), and cleaning chemicals used in fabs. – Tensile Strength: ≥ 15 MPa, ensuring durability and resistance to tearing during installation and operation. – Elongation at Break: ≥ 300%, allowing for proper compression and sealing without permanent deformation. – Certification: Complies with SEMI F17 standards for vacuum seals and ISO 9001 quality control requirements.
Functional Features: – Creates a leak-tight seal in vacuum systems and gas delivery lines, preventing air leakage and gas contamination that could compromise process quality. – Resists degradation from high temperatures and thermal cycling, maintaining sealing performance over extended operational periods. – Withstands exposure to reactive and corrosive process gases, extending the O-ring’s service life and reducing replacement frequency. – Conforms to sealing grooves with minimal compression, ensuring optimal sealing contact without damaging mating components. – Minimizes particle generation, with a smooth surface finish that prevents dust accumulation and contamination of the process environment. – Easy to install and replace, reducing maintenance downtime and improving equipment availability. – Compatible with AMAT’s standard sealing configurations, ensuring seamless integration with vacuum chambers and gas delivery components.
Application Scenarios: – Installed in AMAT’s vacuum chambers, turbomolecular pumps, and vacuum flanges to maintain ultra-high vacuum conditions. – Used in gas delivery lines, manifolds, and valves to prevent gas leakage and cross-contamination between process gases. – Applied in process chamber doors, load locks, and wafer handling ports to seal the process environment from external contaminants. – Suitable for 200mm and 300mm wafer manufacturing processes, including plasma etching, CVD, PVD, and ion implantation. – Ideal for high-volume semiconductor production lines where equipment uptime and process consistency are critical. – Used in research and development facilities for vacuum-based semiconductor process testing and optimization.
