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AMAT 0021-45259 Ceramic Chamber Liner Assembly
Product Description: A high-purity ceramic liner designed to protect process chamber walls from plasma damage and contamination. It provides a chemically inert surface for advanced semiconductor manufacturing processes.
Technical Specifications:
- Material: 99.6% high-purity alumina (Al₂O₃)
- Density: >3.9 g/cm³
- Dielectric Strength: >15kV/mm
Detailed content
- Maximum Operating Temperature: 1700°C
- Thermal Conductivity: 30 W/m·K at 25°C
- Surface Finish: Ra <0.8μm (polished)
- Dimensions: Custom-machined to chamber specifications (typical 300mm diameter)
- Coating: Optional Yttria (Y₂O₃) coating for enhanced plasma resistance
Functional Features:
- Exceptional resistance to plasma erosion and chemical attack
- Low particle generation for ultra-clean process environments
- Excellent thermal stability at extreme process temperatures
- High dielectric strength for electrical isolation
- Easy cleaning and maintenance between process runs
- Precision-machined for perfect fit in AMAT chamber designs
- Long service life reducing chamber maintenance frequency
Application Scenarios:
- Etch chamber liners for dielectric and metal etch processes
- PVD chamber shields for physical vapor deposition
- ALD chamber components for atomic layer deposition
- Plasma cleaning chamber liners
- High-temperature annealing chamber components
