Digital guide
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AMAT 0021-42914
Product Name: Thermal Management Component Assembly
Product Description: A specialized thermal management component designed for precise temperature control in advanced semiconductor manufacturing processes. It efficiently transfers heat while maintaining electrical isolation and vacuum compatibility.
Technical Specifications:
- Material: Composite ceramic-metal construction
Detailed content
- Thermal Conductivity: Graded from 20 to 130 W/m·K
- Operating Temperature Range: -50°C to +480°C
- Thermal Cycling Resistance: >12,000 cycles without failure
- Electrical Isolation: >10¹² ohms resistance
- Vacuum Compatibility: 10⁻⁸ Torr
- Coefficient of Thermal Expansion: Matched to silicon (2.6 ppm/°C)
Functional Features:
- Precision temperature control with minimal thermal lag
- Excellent thermal shock resistance
- High electrical isolation for safe operation
- Low outgassing properties for UHV compatibility
- Long-term stability in harsh semiconductor environments
- Easy integration with existing chamber designs
Application Scenarios:
- Advanced semiconductor wafer processing
- High-temperature annealing systems
- Rapid thermal processing (RTP) equipment
- Atomic layer deposition (ALD) systems
- Wafer inspection and metrology tools
