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AMAT 0021-23550 Precision Chamber Gasket
Product Overview: The AMAT 0021-23550 is a high-precision chamber gasket designed for use in the process chambers of Applied Materials semiconductor equipment. It creates a leak-tight seal between chamber components, such as chamber lids, flanges, and door assemblies, maintaining the ultra-high vacuum environment required for semiconductor processing. This gasket is manufactured from high-performance materials, ensuring exceptional air tightness, durability, and compatibility with harsh process gases and high temperatures. It is a critical component for preventing air leakage and contamination, ensuring the purity and integrity of the process environment.
Technical Specifications: – Material Composition: High-purity copper (99.99%) with a gold plating (thickness 5 μm) for enhanced corrosion resistance and sealing performance. – Dimensions: Outer diameter 200mm, inner diameter 180mm, thickness 2mm, compatible with AMAT’s standard chamber flanges.
Detailed content
– Vacuum Rating: Ultra-high vacuum (UHV) compatible, with a leak rate ≤ 1×10⁻¹² Pa·m³/s (He). – Operating Temperature: -30°C to 450°C, suitable for high-temperature vacuum processes. – Compression Rate: 25-35% of original thickness, ensuring a tight seal when installed with proper torque. – Surface Finish: Polished surface with a surface roughness ≤ 0.1 μm, optimizing sealing contact and minimizing particle generation. – Chemical Compatibility: Resistant to process gases such as CF₄, Cl₂, NH₃, Ar, and cleaning chemicals used in fabs. – Certification: Complies with SEMI F17 standards for vacuum components and ISO 9001 quality control requirements.
Functional Features: – Creates a leak-tight seal between chamber components, maintaining the ultra-high vacuum environment required for semiconductor processing. – Resists corrosion from process gases and plasma exposure, extending the gasket’s service life and reducing maintenance frequency. – Withstands high temperatures and thermal cycling without losing sealing performance, ensuring long-term reliability. – Conforms to flange surfaces, even with minor irregularities, due to its malleable copper construction. – Minimizes particle generation, with a smooth surface that prevents dust accumulation and contamination of the process environment. – Easy to install and replace, reducing maintenance downtime and improving equipment availability. – Compatible with AMAT’s standard process chamber flanges, ensuring seamless integration with existing equipment.
Application Scenarios: – Installed in AMAT’s process chambers for plasma etching, CVD, PVD, and ion implantation. – Used in chamber lids, door assemblies, and flange connections to maintain vacuum integrity. – Applied in 200mm and 300mm wafer manufacturing processes, including advanced technology nodes. – Suitable for semiconductor fabs with strict vacuum and cleanliness requirements. – Ideal for high-volume production lines, where equipment uptime and process consistency are critical. – Used in research and development facilities for vacuum-based semiconductor process development.
