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AMAT 0021-21814
Product Name: High-Temperature Thermal Insulation and Shielding Component Assembly
Product Description: This is a thermal management component used in high-temperature semiconductor process chambers, mainly used for thermal insulation, temperature uniformity control and heat source shielding. It is suitable for high-temperature processes such as deposition and annealing to stabilize process temperature field.
Technical Specifications:
- Main materials: high-purity ceramic, high-temperature composite fiber and special thermal insulation materials
Detailed content
- Continuous operating temperature: up to 450°C, resistant to rapid thermal cycling
- Low thermal conductivity, excellent thermal insulation effect
- Low outgassing rate, meets ultra-high vacuum and cleanroom requirements
- Custom-molded to match chamber internal profile, seamless installation
- Resistant to plasma erosion and chemical gas corrosion
Functional Characteristics:
- Effectively isolates heat transfer and stabilizes temperature distribution in process zone
- Reduces thermal shock to chamber structure and extends component life
- Minimizes particulate and volatile contamination in high-temperature environments
- Maintains dimensional stability under long-term high-temperature operation
- Optimizes energy efficiency and reduces equipment power consumption
Application Scenarios:
- Thermal insulation and shielding in rapid thermal processing (RTP) systems
- High-temperature insulation components for metal oxide deposition chambers
- Temperature field adjustment for dielectric film deposition process
- Thermal management of etching and cleaning chambers in high-temperature processes
