Digital guide
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AMAT 0021-20198
Product Name: High-Purity Ceramic Gas Baffle/Flow Distribution Plate
Product Description: A precision-engineered ceramic plate designed to disrupt, diffuse, and uniformly distribute process gas flow within a semiconductor chamber. It ensures laminar flow and prevents direct gas impingement on the wafer.
Detailed content
Technical Specifications:
- Material: High-purity alumina (Al₂O₃) or Yttria-stabilized zirconia (YSZ)
- Design: Perforated with a precise pattern of micro-drilled holes
- Thickness: 3 mm
- Flatness: ≤ 10 μm TIR (Total Indicator Reading)
- Surface Finish: Smooth, non-wetting surface
Functional Features:
- Uniform Gas Distribution: Creates a homogeneous gas blanket over the wafer.
- Prevents Turbulence: Reduces eddies that cause uneven deposition or etch rates.
- Chemical Resistance: Immune to corrosive etch and deposition chemistries.
- Thermal Shock Resistance: Withstands rapid temperature changes.
- Easy Installation: Designed for simple retrofit and cleaning.
Application: Used in PECVD and ALD chambers to ensure uniform film deposition.
