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AMAT 0021-16782
Product Name: 300mm Middle Shield (SIP CU Chamber)
Product Description: A large, high-quality metal shield for the middle section of a 300mm PVD chamber (Endura 5500 SIP CU). It confines the plasma and protects upper chamber components.
Technical Specifications:
- Wafer Size: 300mm (12-inch).
Detailed content
- Material: High-purity, machined aluminum or stainless steel.
- Dimensions: 12.46″ outer diameter, contoured profile.
- Weight: 7.45 kg.
- Finish: Precision-machined, bead-blasted or coated for plasma resistance.
Functional Features:
- Directs and confines the plasma to the wafer processing region.
- Shields the chamber lid and upper assembly from coating.
- Ensures uniform deposition and etch profiles across the wafer.
- High structural integrity under thermal and mechanical stress.
Application Scenarios:
- Installed in AMAT Endura 5500 PVD SIP CU chambers.
- Used in copper (Cu) and other metal physical vapor deposition processes.
