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Technical Specifications:
- Material: High-grade 6061 aluminum alloy, hard anodized
- Hole Pattern: Precision-drilled uniform array of micro-orifices
- Thickness: 6.35 mm
- Flatness: < 10 μm TTV (Total Thickness Variation)
Functional Features:
- Ensures laminar gas flow and uniform process gas distribution
- Resists corrosion and deposition buildup
- Smooth, non-particulating surfaces
- Easy to clean and replace
Application: Installed in CVD and ALD chambers to ensure thin film uniformity across 200mm/300mm wafers.
