Digital guide
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Technical Specifications:
- Material: High-performance engineering polymer (PEEK / Virgin PTFE composite)
- Machining Tolerance: ±0.005 inches for critical mounting features
- Hardness: 85 Shore D
- Chemical Compatibility: Resistant to all standard semiconductor cleaning chemistries (SC-1, SC-2, IPA)
Functional Features:
- Non-contaminating, low particle generation design
- High mechanical rigidity for stable brush operation
- Precision mounting holes for accurate alignment with drive mechanisms
- Excellent chemical and hydrolytic stability in wet cleaning environments
Application: Integrated into wafer scrubbing and cleaning systems (Reflexion platforms) for 200mm wafer post-CMP cleaning.
