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AMAT 0021-12737 Chamber Insulator Ring
Product Overview: The AMAT 0021-12737 is a high-performance chamber insulator ring designed for use in the process chambers of Applied Materials semiconductor equipment. It serves as an electrical insulator and thermal barrier, separating high-voltage components from the chamber body and preventing heat transfer between different chamber zones. This insulator ring is manufactured from advanced ceramic materials, ensuring excellent electrical insulation, high-temperature resistance, and plasma erosion resistance. It is a critical component for maintaining the integrity of the process chamber, ensuring safe operation and consistent process performance.
Technical Specifications: – Material Composition: High-purity alumina (Al₂O₃) ceramic with a purity of 99.99%, offering excellent electrical insulation and thermal stability. – Dimensions: Outer diameter 150mm, inner diameter 120mm, thickness 10mm, with a surface roughness ≤ 0.2 μm. – Electrical Insulation: Volume resistivity ≥ 1×10¹⁴ Ω·cm at 25°C, ensuring effective electrical isolation between high-voltage components.
Detailed content
– Temperature Resistance: Maximum continuous operating temperature of 1200°C, with short-term resistance up to 1500°C. – Thermal Conductivity: 30 W/m·K at 25°C, providing effective thermal insulation. – Plasma Resistance: Resistant to erosion from plasma (CF₄, Cl₂, Ar) and process gases, minimizing material loss. – Dimensional Tolerance: ±0.01mm, ensuring precise fit within the process chamber. – Certification: Complies with SEMI F17 standards for ceramic components and ISO 9001 quality control requirements.
Functional Features: – Provides effective electrical insulation between high-voltage components (e.g., electrodes) and the chamber body, preventing electrical arcing and equipment damage. – Acts as a thermal barrier, reducing heat transfer between the hot process zone and the chamber exterior, protecting external components. – Resists plasma erosion and chemical attack, extending the component’s service life and reducing maintenance frequency. – Maintains structural integrity at high temperatures, preventing warping or cracking during thermal cycling. – Ensures uniform spacing between chamber components, contributing to consistent plasma distribution and process uniformity. – Minimizes particle generation, with a smooth surface that prevents dust accumulation and contamination. – Integrates seamlessly with AMAT’s process chamber designs, ensuring easy installation and replacement.
Application Scenarios: – Installed in AMAT’s plasma etching, CVD, and PVD process chambers. – Used in 200mm and 300mm wafer manufacturing lines for logic chips, memory chips, and power semiconductor devices. – Applied in high-temperature processes such as thermal annealing and metal deposition. – Suitable for semiconductor fabs with strict cleanliness and process control requirements. – Ideal for high-volume production lines, where equipment uptime and component reliability are essential. – Used in research and development facilities for advanced process chamber designs.
