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AMAT 0021-07089
Product Name: Water Manifold Chamber Liner
Product Description: A precision-engineered water manifold liner designed for semiconductor process chambers, providing efficient water circulation for thermal management while maintaining vacuum integrity.
Technical Specifications:
- Material: 316L stainless steel
Detailed content
- Surface Finish: Electropolished to Ra <0.4μm
- Number of Water Channels: 8 parallel channels
- Flow Capacity: 5 L/min per channel
- Operating Pressure: 0–10 bar
- Operating Temperature: 5–80°C
- Leak Rate: <1×10⁻⁹ atm-cc/sec He
Functional Features:
- Uniform water distribution for consistent thermal control
- Smooth internal surfaces to minimize flow resistance
- High corrosion resistance to deionized water
- Hermetically sealed construction for zero vacuum leakage
- Easy installation and maintenance
- Long service life with minimal wear
Application Scenarios:
- Semiconductor process chamber thermal management
- PVD and CVD equipment cooling systems
- Etching chamber temperature control
- Vacuum chamber heat dissipation
- Wafer processing equipment water circulation
