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AMAT 0020-51915
Product Name: Lower Chamber Liner / Deposition Shield
Product Description: A one-piece, cylindrical protective liner installed in the lower chamber section. It shields the chamber base and pump port from coating accumulation, ensures uniform gas flow, and simplifies maintenance by containing process residues.
Technical Specifications:
- Material: High-purity aluminum or 316L stainless steel
Detailed content
- Coating: Plasma-sprayed yttria (Y₂O₃) for extreme corrosion resistance
- Thickness: 4mm (uniform for consistent erosion life)
- Design: Full-cylinder with precision pump-out slots
- Surface Finish: Ra < 1.6μm to minimize particle trapping
- Mounting: Tool-less locking tabs for quick installation
Key Features:
- Extends time between chamber cleanings (PM cycles)
- Prevents conductive deposits from shorting chamber components
- Optimizes pumping conductance for stable pressure control
- High resistance to etch byproducts and metal deposits
- Precision alignment ensures consistent process repeatability
Application Scenarios:
Used in AMAT Producer & Centura HDP-CVD, PECVD, and ALD chambers. Primarily for dielectric, barrier, and metal film deposition processes.
