Digital guide
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Detailed content
- Density: ≥3.95 g/cm³
- Dielectric Strength: ≥18kV/mm
- Thermal Conductivity: 28 W/m·K
- Temperature Resistance: Up to 1,700°C
- Dimensions: 200mm OD, 160mm ID, 12mm thickness
- Surface Finish: Ground to Ra ≤ 0.6μm
Functional Features:
- Superior electrical isolation for high-voltage components
- Excellent thermal shock resistance during rapid process cycling
- Ultra-high purity minimizes contamination in critical processes
- High mechanical strength prevents fracture under chamber loads
- Resistance to plasma erosion and chemical corrosion
Application Scenarios:
- Electrical isolation in DPS etch chambers
- High-voltage insulation in PVD cathode assemblies
- Semiconductor process chambers requiring dielectric isolation
- Centura platform high-power process modules
