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AMAT 0020-37221 Precision Metal Shield Assembly

Product Overview: The AMAT 0020-37221 is a precision-engineered metal shield assembly designed for Applied Materials semiconductor processing equipment. It protects critical chamber components from plasma erosion, process contamination, and thermal damage, while ensuring uniform plasma distribution across the wafer surface. Manufactured from high-purity aluminum or titanium, this shield assembly delivers exceptional corrosion resistance, thermal stability, and dimensional accuracy for long-term reliability.

Technical Specifications:

  • Material: High-purity 6061-T6 aluminum or commercially pure titanium (Grade 2), customer-specified.

Detailed content

  • Dimensions: Outer diameter 320mm, inner diameter 300mm, height 80mm, with precision-machined mounting flanges.
  • Surface Finish: Electropolished (aluminum) or passivated (titanium) to Ra ≤ 0.2μm.
  • Temperature Resistance: Aluminum: up to 300°C; Titanium: up to 600°C continuous operating temperature.
  • Plasma Resistance: Resistant to erosion from all semiconductor plasma chemistries.
  • Dimensional Tolerance: ±0.01mm for all critical dimensions, ensuring perfect fit.
  • Weight: 1.2kg (aluminum) or 1.8kg (titanium), designed for easy installation.
  • Certification: Complies with SEMI S2/S8 safety standards.

    Functional Features:

  • Protects chamber components from plasma erosion and contamination, extending equipment life.
  • Ensures uniform plasma distribution, improving wafer uniformity and yield.
  • Resists thermal deformation, maintaining dimensional stability during processing.
  • Minimizes particle generation, with a smooth, non-porous surface.
  • Easy to clean and replace, reducing maintenance downtime.
  • Integrates seamlessly with AMAT’s process chamber assemblies.

    Application Scenarios:

  • Installed in AMAT etch, CVD, and PVD chambers for component protection.
  • Used in 200mm and 300mm wafer processing equipment for logic and memory manufacturing.
  • Applied in processes with aggressive plasma chemistries requiring high component protection.
  • Ideal for high-volume fabs where equipment uptime and maintenance efficiency are critical.
  • Deployed in R&D facilities for plasma process development.

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