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AMAT 0020-32991 Chamber Shield Assembly
Product Description: A high-purity ceramic shield designed to protect process chamber walls from plasma erosion and contamination in 200mm semiconductor processing equipment. It provides a chemically inert surface for advanced thin-film processes.
Technical Specifications:
- Material: 99.6% high-purity alumina (Al₂O₃)
- Density: > 3.9 g/cm³
- Maximum Operating Temperature: 1700°C
Detailed content
- Dielectric Strength: > 15kV/mm
- Surface Finish: Ra < 0.8μm (polished interior)
- Dimensions: 300mm diameter × 200mm height
- Weight: 6.5 kg
- Coating: Optional yttria (Y₂O₃) coating for enhanced plasma resistance
Functional Features:
- Exceptional resistance to fluorine and chlorine plasma attack
- Ultra-low particle generation for Class 1 cleanroom compatibility
- Excellent thermal stability at extreme process temperatures
- High dielectric strength for electrical isolation
- Precision-machined for perfect fit in AMAT 200mm chambers
- Easy installation and removal for maintenance
- Long service life reducing chamber cleaning frequency
Application Scenarios:
- 200mm etch chamber shields for dielectric and metal etching
- PVD chamber shields for physical vapor deposition
- ALD chamber components for atomic layer deposition
- Plasma cleaning chamber shields for maintenance
- High-temperature annealing chamber components
