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AMAT 0020-30552 Wafer Pedestal Assembly
Product Description: A high-precision electrostatic chuck (ESC) pedestal assembly engineered for 200mm wafer handling and processing in semiconductor manufacturing equipment. It provides stable wafer clamping, precise temperature control, and electrical biasing for advanced thin-film deposition and etching processes.
Technical Specifications:
- Wafer Compatibility: 200mm (8-inch) silicon wafers
- Chuck Type: Electrostatic (Coulombic) ESC
Detailed content
- Clamping Voltage: 0–3000V DC (adjustable)
- Temperature Control Range: 20°C to 450°C
- Heating Element: Embedded resistive heater (dual-zone)
- Cooling: Backside helium cooling (0–5 Torr)
- Material: Aluminum nitride (AlN) ceramic with 316L stainless steel base
- Surface Finish: Ra < 0.8 μm (polished)
- Dimensions: 250mm diameter × 75mm height
- Weight: 4.8 kg
Functional Features:
- Uniform wafer clamping with < 5% voltage variation across wafer surface
- Precise dual-zone temperature control with ±0.5°C stability
- Low particle generation for ultra-clean processing environments
- Excellent thermal conductivity for rapid heat transfer
- DC biasing capability for plasma process optimization
- Seamless integration with AMAT Centura and Endura platforms
- Long service life with minimal maintenance requirements
Application Scenarios:
- PVD chambers for metal deposition (Al, Cu, Ti, Ta)
- CVD chambers for dielectric film growth (SiO₂, Si₃N₄)
- Etch chambers for dielectric and metal etching processes
- Ion implantation systems for wafer clamping during doping
- Annealing chambers for controlled thermal processing
