Digital guide
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AMAT 0020-30420
Product Name: Electrostatic Chuck Ring Assembly
Product Description: A precision support ring designed to surround and stabilize wafers on electrostatic chucks during high-vacuum semiconductor processing. It ensures edge uniformity and prevents thermal or process irregularities at wafer peripheries.
Technical Specifications:
- Material: High-purity ceramic or aluminum alloy
Detailed content
- Surface Treatment: Electropolished or passivated finish
- Dimensional Tolerance: ±0.01 mm
- Thermal Conductivity: Optimized for uniform heat distribution
- Compatibility: 200mm and 300mm wafer processing systems
- Hardness: High structural rigidity to prevent deformation
Functional Features:
- Precise wafer centering and edge protection
- Uniform thermal distribution across wafer surface
- Minimized edge effects during deposition and etching
- Low outgassing for ultra-high vacuum compatibility
- High resistance to plasma and chemical corrosion
- Easy installation and replacement during PM cycles
Application Scenarios:
- Electrostatic chuck (ESC) systems
- Plasma etching and deposition processes
- Wafer thermal processing equipment
- Semiconductor device manufacturing
- Advanced node wafer production lines
