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AMAT 0020-29750 Ceramic Chamber Liner
Product Description: A high-purity ceramic liner designed to protect 200mm process chamber walls from plasma erosion and chemical contamination. It provides a chemically inert, low-particle surface for advanced semiconductor manufacturing processes, extending chamber maintenance intervals.
Technical Specifications:
- Material: 99.6% high-purity alumina (Al₂O₃)
- Density: > 3.9 g/cm³
- Dielectric Strength: > 15kV/mm
Detailed content
- Maximum Operating Temperature: 1700°C
- Thermal Conductivity: 30 W/m·K at 25°C
- Surface Finish: Ra < 0.8 μm (polished interior)
- Dimensions: 300mm diameter × 250mm height (200mm chamber compatible)
- Coating: Optional yttria (Y₂O₃) coating for enhanced plasma resistance
- Weight: 7.2 kg
Functional Features:
- Exceptional resistance to fluorine and chlorine plasma erosion
- Ultra-low particle generation for Class 1 cleanroom compatibility
- Excellent thermal stability at extreme process temperatures
- High dielectric strength for electrical isolation from chamber walls
- Precision-machined for perfect fit in AMAT 200mm chambers
- Easy installation and removal for maintenance
- Long service life, reducing chamber cleaning frequency
Application Scenarios:
- 200mm etch chamber liners for dielectric and metal etch
- PVD chamber shields for physical vapor deposition processes
- ALD chamber components for atomic layer deposition
- Plasma cleaning chamber liners for chamber maintenance
- High-temperature annealing chamber components
