Digital guide
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AMAT 0020-26173
Product Name: Gas Distribution Baffle / Plate Assembly
Product Description: A precision-perforated flow plate installed beneath the showerhead to create a uniform, laminar gas flow distribution across the wafer surface. It eliminates turbulence and ensures consistent process gas delivery.
Technical Specifications:
- Material: High-purity, electropolished 316L stainless steel
Detailed content
- Hole Pattern: 200+ precision-drilled orifices (0.8mm diameter)
- Porosity: Optimized for uniform mass flow distribution
- Flatness: < 5μm over entire surface
- Temperature Rating: Up to 400°C continuous
- Mounting: Centering pins for perfect alignment with showerhead
Key Features:
- Breaks up high-velocity gas streams into uniform flow
- Eliminates edge effects and improves film thickness uniformity
- Resists clogging and easy to clean in-place
- High thermal stability prevents warping at process temperatures
- Compatible with all UHV process gases (corrosive & inert)
Application Scenarios:
Fitted in AMAT PECVD, ALD, and Epitaxial Deposition chambers (Centura, Endura). Essential for depositing high-uniformity films like ILD, gate oxide, and high-k dielectrics.
