Digital guide
You are here:
AMAT 0020-25897
Product Name: Edge Ring Assembly
Product Description: A precision-machined annular component used in semiconductor process chambers to stabilize wafer position, improve plasma uniformity, and protect chamber interior structures from process byproducts.
Technical Specifications:
- Material: High-grade aluminum alloy with hard anodized coating
Detailed content
- Surface Finish: Electropolished, Ra ≤ 0.5 μm
- Dimensional Tolerance: ±0.01 mm
- Temperature Resistance: Up to 250°C
- Weight: Approximately 0.6 kg
- Compatibility: Designed for standard 200mm wafer process chambers
Functional Features:
- Optimizes plasma distribution across wafer surface
- Reduces edge effects during etching and deposition
- Resists plasma erosion and chemical corrosion
- Minimizes particle generation and accumulation
- Ensures consistent process repeatability
- Easy to install, clean, and replace during maintenance
Application Scenarios:
- Plasma etching systems
- PVD and CVD deposition chambers
- Semiconductor wafer processing platforms
- AMAT Centura and Endura series equipment
- Advanced node wafer manufacturing
