Digital guide
You are here:
Detailed content
-
- Surface Finish: Electropolished to Ra ≤ 0.8μm for ultra-high cleanliness
- Thickness: 3.2mm ± 0.05mm
- Configuration: Perforated with precisely drilled gas distribution holes
- Functional Features:
- Ensures uniform gas distribution across wafer surface
- Minimizes particle generation through smooth, crevice-free design
- Protects critical chamber components from process gas exposure
- Easy to install and replace during preventive maintenance
- Application Scenarios:
- Used in AMAT Centura etch and deposition chambers
- Applied in chemical vapor deposition (CVD) processes
- Deployed in plasma etch applications requiring precise gas delivery
- Suitable for both 200mm and 300mm wafer processing platforms
