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AMAT 0020-25658 Vespel Centering Clamp Ring

Product Overview: The AMAT 0020-25658 is a high-performance centering clamp ring manufactured from Vespel (polyimide) material, designed exclusively for Applied Materials semiconductor equipment. It serves as a precision centering and clamping component for process chamber inserts, gas distribution plates, and wafer support assemblies, ensuring precise alignment and secure fastening in high-temperature, high-vacuum environments. Vespel’s unique properties make this clamp ring resistant to thermal expansion, chemical attack, and plasma erosion, delivering long-term reliability in demanding fab conditions.

Technical Specifications:

  • Material: Vespel SP-21 polyimide, reinforced with carbon fiber for enhanced mechanical strength.

Detailed content

  • Dimensions: Outer diameter 220mm, inner diameter 200mm, thickness 8mm, with precision-machined centering grooves.
  • Temperature Resistance: Continuous operating temperature up to 300°C, short-term peak up to 350°C.
  • Coefficient of Thermal Expansion: 2.5×10⁻⁶/°C, matching ceramic and metal chamber components for zero misalignment.
  • Hardness: Shore D 85, providing secure clamping without component deformation.
  • Chemical Compatibility: Resistant to all semiconductor process gases, cleaning chemicals, and plasma exposure.
  • Dimensional Tolerance: ±0.005mm for inner/outer diameters, ensuring perfect centering.
  • Certification: Complies with SEMI S2/S8 safety standards and RoHS environmental requirements.

    Functional Features:

  • Provides precise centering of chamber components, ensuring uniform plasma distribution and process consistency.
  • Delivers secure clamping force without damaging delicate ceramic or metal inserts.
  • Maintains dimensional stability across extreme temperature fluctuations, eliminating alignment drift.
  • Resists plasma erosion and chemical degradation, extending service life up to 5,000 process hours.
  • Minimizes particle generation, with a smooth surface finish that prevents dust accumulation.
  • Easy to install and replace, reducing chamber maintenance downtime.

    Application Scenarios:

  • Used in AMAT oxide, metal, and nitride etch chambers for centering gas distribution plates.
  • Installed in CVD and PVD chambers to clamp wafer support pedestals and chamber liners.
  • Applied in 200mm wafer processing equipment for centering process inserts and shadow rings.
  • Ideal for processes requiring high-temperature stability and zero component misalignment.
  • Deployed in fabs using reactive etch chemistries where chemical resistance is critical.

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