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AMAT 0020-24719
Product Name: 200mm Aluminum Cover Ring Assembly
Product Description: A precision-machined aluminum component designed to surround and protect 200mm wafers during semiconductor processing. It ensures proper wafer positioning and prevents edge effects during deposition and etch processes.
Technical Specifications:
- Material: High-purity aluminum (AL 233-3889-52)
Detailed content
- Wafer Compatibility: 200mm (8-inch) wafers
- Surface Finish: Electropolished for low particle generation
- Dimensions: Outer diameter 270mm, inner diameter 204mm
- Thickness: 3mm
- Weight: 0.45 kg
Functional Features:
- Precise wafer centering and alignment
- Protection of wafer edges from process irregularities
- Minimized particle contamination
- Excellent thermal conductivity
- Easy installation and removal
- Compatible with multiple process chemistries
Application Scenarios:
- Physical Vapor Deposition (PVD) systems
- Etch processing chambers
- Chemical Mechanical Planarization (CMP)
- Wafer handling and transfer stations
- AMAT Endura and Centura platforms
