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AMAT 0020-24534 Showerhead Gas Distribution Plate
Product Description: A precision-machined gas distribution showerhead plate designed for uniform gas delivery in semiconductor process chambers. It ensures consistent gas flow distribution across the wafer surface, critical for uniform thin-film deposition and etching processes.
Technical Specifications:
- Material: 6061-T6 aluminum alloy (hard-anodized)
- Diameter: 300mm (for 200mm wafer processing)
Detailed content
- Thickness: 25mm
- Hole Pattern: 400× 0.5mm diameter holes (uniform distribution)
- Surface Finish: Ra < 0.4 μm (electropolished)
- Gas Inlet: 1/4″ VCR fitting (center-mounted)
- Operating Pressure: 0–10 Torr (process chamber)
- Temperature Range: 0–200°C
- Weight: 2.1 kg
Functional Features:
- Uniform gas distribution with < 3% flow variation across wafer surface
- Hard-anodized surface for corrosion resistance and low particle generation
- Precision-drilled holes for consistent gas flow velocity
- Center gas inlet design minimizes flow turbulence
- Easy cleaning and maintenance between process runs
- Compatible with UHP process gases (Ar, N₂, O₂, SiH₄, etc.)
- Perfect fit for AMAT Centura CVD and PVD chambers
Application Scenarios:
- Gas distribution in PECVD chambers for dielectric film deposition
- Showerhead plates in ALD systems for atomic layer deposition
- Uniform gas delivery in etch chambers for isotropic etching processes
- Gas distribution plates in pre-clean chambers for wafer surface preparation
- Thermal CVD systems for high-temperature film growth
