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AMAT 0020-23354
Product Name: Focus Ring Assembly
Product Description: A precision-machined metal ring designed to concentrate and shape plasma distribution above the wafer surface, improving process uniformity and reducing edge effects during semiconductor etching and deposition.
Technical Specifications:
- Material: High-grade aluminum or stainless steel
Detailed content
- Surface Coating: Hard anodized or plasma-resistant coating
- Dimensional Tolerance: ±0.01 mm
- Weight: Approximately 0.5 kg
- Thermal Stability: Deformation-free under cyclic thermal loads
- Compatibility: Fits standard AMAT chamber designs
Functional Features:
- Optimizes plasma density distribution
- Improves critical dimension uniformity across wafer
- Reduces micro-particle contamination
- Resists erosion from reactive ion plasmas
- Easy to clean and reinstall
- Ensures consistent process repeatability
Application Scenarios:
- Conductive and dielectric etch processes
- PVD and CVD thin-film deposition
- 200mm and 300mm wafer manufacturing
- Semiconductor logic and memory chip production
- Plasma-assisted material processing
