Digital guide
You are here:
AMAT 0020-23045
Product Name: Ceramic Process Shield Assembly
Product Description: A high-purity ceramic shield engineered to protect chamber components from plasma erosion and deposition buildup during semiconductor etching and deposition processes.
Technical Specifications:
- Material: High-purity alumina (Al₂O₃) ceramic, 99.8% purity
Detailed content
- Coating: Uniform tin oxide (SnO₂) coating for enhanced plasma resistance
- Surface Finish: Smooth, non-porous finish to minimize particle adhesion
- Thermal Stability: Withstands continuous operating temperatures up to 1200°C
Functional Features:
- Excellent resistance to plasma etching and chemical corrosion from process gases.
- Low outgassing rate maintains ultra-high vacuum (UHV) chamber integrity.
- Prevents metallic contamination of wafers from chamber wall sputtering.
- Precision-machined for exact fit within designated process chambers.
Application Scenarios: Etch chambers, PECVD, and ICP deposition systems requiring high-purity ceramic shielding.
