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AMAT 0020-22296
Product Name: Edge Ring / Focus Ring
Product Introduction:
The Edge Ring is a consumable or semi-permanent component installed at the periphery of the wafer pedestal in an etch or deposition chamber. It protects the chamber walls from plasma erosion and controls the plasma sheath profile at the wafer edge, preventing edge exclusion and ensuring uniform processing across the entire wafer surface, including the bevel area.
Technical Specifications:
- Material: Silicon (Si), Silicon Carbide (SiC), Quartz, or Yttria-coated Aluminum.1.
Detailed content
- Geometry: Annular ring shape matching the wafer diameter (200mm/300mm).
- Temperature Resistance: High thermal shock resistance (up to 600°C+).
- Plasma Erosion Rate: Low sputtering yield to extend component lifetime.
Functional Features:
- Plasma Confinement: Shapes the electric field lines to prevent plasma from attacking the chamber hardware.
- Wafer Edge Protection: Shields the backside and edge of the wafer from deposition or excessive etching.
- Process Tuning: The material and geometry can be changed to tune the ion angle distribution at the wafer edge.
- Seasoning Capability: Some rings are “seasoned” (pre-coated) with a film to match the process and reduce particle generation.
Application Scenarios:
- Oxide/Nitride Etch: Used in high-selectivity etching processes.
- Metal Etch: Protects the chamber from halogen-based chemistries.
- PVD/CVD: Controls film buildup at the wafer edge to prevent flaking and particles.
- Main Equipment: Applied Materials Super E, Kiyo, and other conductor and dielectric etch tools.
