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AMAT 0020-21104 Wafer Centering Ring Assembly
Product Description: A precision-machined component designed to accurately center semiconductor wafers within processing chambers, ensuring uniform process results across the entire wafer surface. Critical for maintaining process consistency in both 200mm and 300mm wafer manufacturing environments.
Technical Specifications:
- Wafer Compatibility: 200mm (8-inch) and 300mm (12-inch) semiconductor wafers
- Material: High-purity aluminum with hard anodized coating
Detailed content
- Surface Finish: Ra < 0.8μm for minimal particle generation
- Centering Tolerance: ±0.05mm total indicated runout (TIR)
- Mounting: Snap-fit design with alignment pins for precise positioning
- Temperature Resistance: -20°C to +250°C continuous operation
- Weight: 0.4kg for 200mm version, 0.6kg for 300mm version
Functional Features:
- Self-centering design ensuring accurate wafer positioning
- Minimal contact with wafer edge reducing contamination risk
- Easy installation and removal without special tools
- Chemical resistance to all common semiconductor process chemicals
- Low particulate generation for ultra-clean processing environments
- Reusable design with long service life
- Compatibility with standard AMAT chamber designs
Application Scenarios:
- Wafer centering in deposition chambers
- Etch process wafer positioning
- Thermal processing equipment wafer alignment
- Wafer handling system centering
- Inspection and metrology equipment positioning
- Process development and R&D environments
