Digital guide
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AMAT 0020-10059
- Product Name: 200mm Wafer Lift Ring
- Product Description: Precision-machined metal lift ring designed to interface with wafer lift pins, providing stable and secure support for 200mm wafers during vertical transfer in semiconductor process chambers. It ensures precise wafer alignment for robot pick-and-place operations.
- Technical Specifications:
- Material: 6061-T6 Aluminum Alloy
Detailed content
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- Wafer Compatibility: 200mm (8-inch)
- Outer Diameter: 210mm
- Inner Diameter: 198mm
- Thickness: 6mm
- Mounting: 3-point attachment with M4 threaded holes
- Weight: 0.45 kg
- Functional Features:
- Ultra-smooth surface to prevent wafer scratching and particle generation
- Precision-machined profile for exact centering and stability
- Lightweight yet rigid construction for fast, repeatable motion
- Corrosion-resistant anodized coating for chamber compatibility
- Direct bolt-on installation with existing lift pin assemblies
- Balanced design to eliminate wafer tilt during lifting
- Applications: Wafer support and transfer in P5000, Centura, and Endura platforms for PVD, CVD, and Etch processes; critical for reliable 200mm wafer handling between process modules.
