Digital guide
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Detailed content
- Finish: Hard-anodized (Type III)
- Lift Pin Configuration: 3-point contact design
- Dimensions: 120mm diameter, 50mm height
- Weight: 0.35kg
Functional Features:
- Secure, non-slip wafer support during transfer
- Minimal contact area to reduce wafer contamination risk
- Lightweight design for fast robotic acceleration
- Wear-resistant anodized surface
- Precision alignment features for accurate positioning
Application Scenarios:
- Wafer lifting in P5000 and Centura platforms
- Robotic wafer transfer system support
- Semiconductor process chamber wafer positioning
- Multi-size wafer handling applications
