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AMAT 0010-77533
Product Name: 200mm MIRRA Titan 1 CMP Polishing Head Assembly
Product Description: This is a special polishing head assembly designed for Applied Materials MIRRA chemical mechanical planarization (CMP) system, specially used for 200mm wafer surface polishing. It realizes uniform pressure application, stable wafer clamping and efficient slurry distribution, ensuring the global and local flatness of wafer surface.
Technical Specifications:
- Applicable wafer size: 200mm (8-inch) semiconductor wafers
Detailed content
- Structure: integrated retainer, pressure membrane and pneumatic control cavity
- Main materials: high-performance engineering plastics, 316L stainless steel and ceramic components
- Pressure control range: 0.1–5.0 psi, adjustable with high precision
- Surface roughness meets ultra-clean semiconductor standards, low particle release
- Compatible with Titan 1 CMP system pneumatic control system
Functional Characteristics:
- Provides uniform radial pressure distribution to avoid edge over-polishing
- Stable wafer clamping, no slipping or edge damage during high-speed rotation
- Optimizes the flow and distribution of polishing slurry to improve polishing uniformity
- Supports multi-zone independent pressure adjustment to adapt to different process requirements
- Wear-resistant and corrosion-resistant, long service life under high-frequency operation
Application Scenarios:
- Dielectric layer CMP polishing for 200mm wafer manufacturing
- Metal tungsten, copper interconnect planarization process
- Polishing process of logic chips, analog chips and discrete devices
- Wafer planarization treatment in advanced packaging and MEMS manufacturing
