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AMAT 0010-77522
Product Name: Wafer Handling Robot Blade Assembly
Product Description: A precision-engineered robot blade assembly designed for non-contact, contamination-free wafer transport in semiconductor vacuum and cleanroom environments. It ensures accurate positioning and secure handling of wafers during manufacturing processes.
Technical Specifications:
- Material: High-strength 6061-T6 aluminum alloy
Detailed content
- Surface Coating: Hard anodized (50 μm thickness)
- Wafer Compatibility: 200mm wafers
- Length: 380mm
- Width: 45mm
- Thickness: 3.2mm
- Weight: 0.28kg
- Flatness: <0.015mm across entire surface
- Operating Temperature: -10°C to +65°C
- Coefficient of Friction: <0.2 for non-slip wafer contact
Functional Features:
- Ultra-smooth surface finish to minimize particle generation
- High rigidity for precise, repeatable wafer positioning
- Lightweight construction for fast acceleration and movement
- Non-contaminating surface treatment for process purity
- Precision CNC machining for perfect wafer centering
- Compatibility with standard AMAT robot end-effectors
- Low vibration profile for stable wafer transport
Application Scenarios:
- Semiconductor wafer handling robots (Centura/Endura platforms)
- Vacuum chamber wafer transfer systems
- Wafer loading/unloading automation
- Cleanroom wafer transport operations
- Semiconductor manufacturing process integration
