Digital guide
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Technical Specifications:
- Material: High-modulus carbon fiber composite or hard-anodized 6061 aluminum alloy
- Wafer Compatibility: 200mm/300mm wafers
- Surface Finish: Ultra-smooth, low-particulate coating (Ra ≤ 0.4 μm)
- Weight: < 200 grams
- Repeatability: ± 0.02 mm
Functional Features:
- Optimized thin-profile design minimizes particle generation and interference
- High strength-to-weight ratio for fast, accurate motion
- Non-contacting edge geometry prevents wafer scratching
- Vacuum-compatible, low-outgassing materials
Application: Deployed in wafer transfer robots (Endura, Centura platforms) for PVD, CVD, and Etch process modules.
