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AMAT 0010-76136

  • Product Name: Wafer Lift HTHU Heater Assembly
  • Product Description: Heated wafer lift pin assembly with integrated heating elements, maintaining wafer temperature during transfer in high-temperature process modules.
  • Technical Specifications:
    • Wafer Size: 150mm (6″) / 200mm (8″)

Detailed content

    • Heating Power: 150W
    • Temperature Range: 50–200°C
    • Control: Integrated PT100 RTD sensor
    • Voltage: 24V DC
    • Pin Material: High-purity alumina ceramic
    • Insulation: Ceramic thermal isolation
  • Functional Features:
    • Uniform heating across all lift pins
    • Precise temperature control with closed-loop feedback
    • Low thermal mass for fast response
    • Non-contaminating ceramic components
    • Vacuum-compatible construction
    • Direct replacement for standard lift assemblies
  • Applications: High-temperature wafer handling in HTHU (High Temperature Heater Units) and ALD processes; prevents temperature loss during wafer transfer.

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