Digital guide
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AMAT 0010-52595
- Product Name: 300mm Wafer Lift Pin Assembly
- Product Description: A precision-engineered lift pin assembly for vertically positioning 300mm wafers during transport and processing in high-vacuum chambers.
- Technical Specifications:
- Material: Silicon carbide (SiC) ceramic pin, 316L stainless steel base.
Detailed content
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- Pin Dimensions: 10mm diameter x 150mm length.
- Travel: 50mm vertical lift.
- Surface Finish: Pin surface polished to Ra < 0.4 μm.
- Load Capacity: 1 kg maximum.
- Operating Temperature: -20°C to 300°C.
- Functional Features:
- Zero particle generation due to ultra-smooth ceramic surface.
- High wear resistance for millions of lift cycles.
- Excellent thermal stability and low thermal expansion.
- Non-magnetic and chemically inert to process environments.
- Integrated bellows seal for vacuum integrity.
- Application Scenarios: Deployed in 300mm PVD, CVD, and Etch chambers on Endura and Centura platforms for wafer transfer between robot and pedestal.
