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AMAT 0010-39912 Wafer Handling Robot End Effector

Product Overview: The AMAT 0010-39912 is a precision-engineered wafer handling robot end effector designed for Applied Materials automated wafer handling systems. It provides secure, non-contact wafer gripping and transfer using vacuum suction, ensuring zero wafer damage and contamination. This end effector features a lightweight, rigid design, advanced vacuum control, and compatibility with 200mm/300mm wafers, making it critical for high-speed, high-volume semiconductor manufacturing.

Technical Specifications:

  • Material: Carbon fiber composite body, with high-purity ceramic suction cups.

Detailed content

  • Wafer Compatibility: 200mm and 300mm wafers, thickness 0.5–2mm, including thin wafers.
  • Suction System: 6×precision vacuum cups, with individual vacuum control and pressure monitoring.
  • Positioning Accuracy: ±0.02mm, repeatability ±0.01mm, ensuring precise wafer placement.
  • Operating Speed: Maximum linear speed 1.5m/s, acceleration 3m/s², with smooth motion control.
  • Vacuum Level: Operating vacuum 0.8–0.95 bar, with vacuum loss detection and alarm.
  • Weight: 0.7kg, lightweight design for fast robot motion.
  • Operating Environment: Cleanroom Class 1, temperature 18–25°C, humidity 40–60% (non-condensing).
  • Certification: Complies with SEMI S2/S8 safety standards and ISO 14644-1 cleanroom requirements.

    Functional Features:

  • Provides non-contact vacuum gripping, eliminating wafer scratches and contamination.
  • Delivers precise wafer positioning and transfer, improving process efficiency and yield.
  • Features individual vacuum cup control, ensuring secure gripping even with warped wafers.
  • Lightweight carbon fiber design maximizes robot speed and acceleration.
  • Minimizes particle generation, with smooth, anti-static surfaces.
  • Integrates seamlessly with AMAT’s wafer handling robots and control systems.

    Application Scenarios:

  • Installed in AMAT automated wafer handling systems for Centura and Endura equipment.
  • Used in 200mm and 300mm wafer fabs for logic, memory, and power semiconductor manufacturing.
  • Applied in wafer transfer between load locks, process chambers, and inspection stations.
  • Ideal for high-volume production lines requiring fast, reliable wafer handling.
  • Deployed in R&D facilities for automated wafer processing development.

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