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AMAT 0010-24299
Product Name: Electrostatic Chuck (ESC) Pedestal Assembly
Product Description: Precision pedestal assembly with integrated electrostatic chuck for wafer clamping in PVD processes.
Technical Specifications:
- Wafer Compatibility: 300mm wafers
- Chuck Type: Dual-zone Coulombic electrostatic chuck
Detailed content
- Material: Aluminum nitride (AlN) ceramic
- Heating Element: Integrated resistive heater (300°C max)
- Temperature Uniformity: ±2°C across wafer surface
- Clamping Voltage: 1-3kV DC
- Cooling: Internal coolant passages
Functional Features:
- Secure, non-contact electrostatic wafer clamping
- Uniform temperature distribution for precise process control
- Rapid heating and cooling cycles for throughput optimization
- Excellent thermal conductivity for efficient heat transfer
- RFI/EMI shielding for electrical noise suppression
Application Scenarios:
- Electrostatic wafer clamping in Endura PVD chambers
- High-temperature metal deposition processes
- Advanced semiconductor wafer processing requiring precise temperature control
- 300mm physical vapor deposition systems
