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AMAT 0010-10901
Product Introduction: This component kit is specifically designed for the Applied Materials Endura Volta HD+ Physical Vapor Deposition (PVD) system. It serves as a critical maintenance and upgrade kit to ensure chamber stability during high-density plasma sputtering processes. The kit typically includes wear-resistant shields, collimators, and chamber liners optimized for copper and aluminum metallization.
Technical Specifications:
- Compatibility: Endura Volta HD+ PVD Cluster Tool
- Wafer Size: 300mm (12-inch)
Detailed content
- Material: Aluminum, Anodized Aluminum, and Stainless Steel (316L)
- Process Type: Physical Vapor Deposition (Sputtering)
- Shielding Configuration: Multi-piece assembly including bottom shield, sidewall shield, and target shield
Functional Features: - Plasma Confinement: Optimized geometry to confine plasma and reduce sputtering on non-target areas.
- Particle Control: Specialized coatings and smooth surfaces to minimize particle generation and fall-on during high-power sputtering.
- Thermal Management: Designed to withstand high thermal loads (up to 600°C) during deposition processes.
- Quick Maintenance: Modular design allows for rapid chamber cleaning and part replacement to minimize tool downtime (Match Time).
Application Scenarios: - Copper interconnect deposition for advanced logic and memory nodes.
- Aluminum pad deposition for backend-of-line (BEOL) packaging.
- High-density plasma PVD processes requiring low particle counts and high film uniformity.
- Semiconductor foundries and IDM facilities running 7nm, 5nm, and 3nm process nodes.
