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AMAT 0010-09105
Product Name: Pedestal / Electrostatic Chuck (ESC) Assembly
Product Description: A multi-functional assembly that supports, clamps (via electrostatic force), and precisely controls the temperature of the wafer during processing.
Technical Specifications:
- Type: Dual-zone or single-zone electrostatic chuck (ESC).
Detailed content
- Heating/Cooling: Integrated resistive heating elements and/or backside helium cooling channels.
- Material: High-purity ceramic (e.g., Aluminum Nitride – AlN) for excellent thermal conductivity.
- Voltage: 2000V – 4000V DC for electrostatic clamping.
Functional Features:
- Precise Temperature Control: Maintains wafer temperature uniformity (±1°C).
- Electrostatic Clamping: Provides firm, contactless holding to prevent micro-oscillation.
- Backside Gas Cooling: Helium gas pressure control for efficient heat extraction.
- RF Compatibility: Designed to couple RF power into the process plasma efficiently.
Application: The central wafer support in PVD, Etch, and CVD chambers (e.g., Endura, Centura) requiring tight thermal control.
