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AMAT 0010-09093 Wafer Chuck Heater Assembly
Product Description: A high-performance heating assembly designed for precise wafer temperature control in semiconductor processing chambers, providing uniform heating across the entire wafer surface.
Technical Specifications:
- Wafer Compatibility: 150mm (6-inch) and 200mm (8-inch) semiconductor wafers
- Temperature Range: Ambient to 450°C operational range
Detailed content
- Temperature Uniformity: ±1°C across entire wafer surface at setpoint
- Heating Elements: Multi-zone embedded resistance heating elements
- Material: High-purity aluminum nitride (AlN) ceramic construction
- Mounting: Precision flange mounting with thermal isolation features
- Power Requirements: 480V AC, 3-phase, 5kW maximum power consumption
Functional Features:
- Multi-zone independent temperature control for profile optimization
- Rapid heat-up and cool-down cycles for increased throughput
- Exceptional temperature uniformity for consistent process results
- Ceramic construction provides excellent thermal conductivity and electrical isolation
- Low particulate generation for ultra-clean processing environments
- Built-in overtemperature protection and thermal runaway prevention
Application Scenarios:
- Thermal oxide growth processes in oxidation furnaces
- Photoresist baking and curing applications in lithography processes
- Wafer pre-heating for improved deposition uniformity
- Annealing processes for dopant activation and crystal structure repair
- Precision temperature control in low-pressure chemical vapor deposition (LPCVD)
