Digital guide
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AMAT 0010-08538
Product Name: Wafer Handling Robot Blade Assembly
Product Description: A precision-engineered robot blade assembly for semiconductor wafer handling systems. It provides secure, non-contaminating wafer transport in vacuum and cleanroom environments.
Technical Specifications:
- Material: High-strength aluminum alloy (6061-T6)
Detailed content
- Surface Coating: Hard anodized (50 μm thickness)
- Wafer Compatibility: 200 mm wafers
- Length: 350 mm
- Width: 40 mm
- Thickness: 3 mm
- Weight: 0.25 kg
- Flatness: < 0.02 mm across entire surface
- Operating Temperature: -10°C to +60°C
Functional Features:
- Ultra-smooth surface to minimize particle generation
- High rigidity for precise wafer positioning
- Lightweight design for fast, accurate movement
- Non-contaminating surface coating
- Precision machining for perfect wafer centering
- Compatibility with standard robot end-effectors
Application Scenarios:
- Semiconductor wafer handling robots
- Vacuum chamber wafer transfer
- Wafer loading/unloading systems
- Cleanroom wafer transport
- Semiconductor manufacturing automation
