Digital guide
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AMAT 0010-02477
Product Name: Electrostatic Chuck (ESC) Assembly
Product Description: A high-performance electrostatic chuck assembly designed for secure wafer clamping and precise temperature control in semiconductor process chambers.
Technical Specifications:
- Material: High-purity alumina ceramic (99.8%)
Detailed content
- Wafer Compatibility: 300mm wafers
- Chucking Voltage: 0–3 kV DC
- Temperature Control Range: 20°C to 450°C
- Temperature Uniformity: ±1°C across wafer surface
- Dielectric Strength: >20 kV/mm
- Operating Pressure: UHV compatible (10⁻⁹ Torr)
- Dimensional Tolerance: ±0.02 mm
Functional Features:
- Secure electrostatic clamping with zero particle generation
- Precise temperature control for uniform wafer processing
- Excellent thermal conductivity for efficient heat transfer
- High electrical insulation properties
- Chemical inertness to process environments
- Long service life with minimal maintenance
- Compatibility with standard AMAT process chambers
Application Scenarios:
- Semiconductor wafer processing equipment
- PVD/CVD process chambers
- Etching systems
- High-temperature wafer processing
- Vacuum chamber wafer clamping systems
